CVE-2023-53242: thermal/drivers/hisi: Drop second sensor hi3660
In the Linux kernel, the following vulnerability has been resolved:
thermal/drivers/hisi: Drop second sensor hi3660
The commit 74c8e6bffbe1 ("driver core: Add __alloc_size hint to devm
allocators") exposes a panic "BRK handler: Fatal exception" on the
hi3660_thermal_probe funciton.
This is because the function allocates memory for only one
sensors array entry, but tries to fill up a second one.
Fix this by removing the unneeded second access.
Security readout for executives and security teams
Plain-English summary
CVE-2023-53242 is a Linux kernel availability bug in the HiSilicon hi3660 thermal driver. The driver allocated space for one sensor entry but wrote a second one, causing a fatal kernel exception. Business impact is likely device outage, not data theft, and exposure appears limited to affected kernels using this driver.
Executive priority
Handle through normal kernel patch governance, with higher priority for embedded or appliance fleets using HiSilicon hi3660 hardware. There is no source-backed active exploitation signal, but the impact can be a full device outage where exposed.
Technical view
The issue is in thermal/drivers/hisi during hi3660_thermal_probe. A prior driver-core allocation-size hint exposed that the code allocated one sensors array entry but accessed a second. The resolved fix removes the unnecessary second access. CVSS 3.1 is 5.5: local, low complexity, low privileges, no user interaction, high availability impact.
Likely exposure
Exposure is most likely on Linux systems running affected kernel versions with the HiSilicon hi3660 thermal driver present and reachable. General-purpose servers without this hardware or driver path are less likely exposed. The source bundle lists Linux as affected, including versions around 4.20 through 6.3 and stable branch points.
Exploitation context
The source bundle does not show CISA KEV listing or other evidence of active exploitation. The CVSS vector requires local low privileges and affects availability only. Treat this as a kernel panic risk on relevant hardware rather than a remote compromise issue.
Researcher notes
Focus validation on code lineage and hardware reachability. The key condition is an out-of-bounds second sensor array access in hi3660_thermal_probe. The public record does not provide exploit details, affected distro package names, or a complete product matrix beyond Linux kernel references.
Mitigation direction
Update affected Linux kernels to versions containing the referenced stable fixes.
Check distribution or device-vendor advisories for packaged kernel fix availability.
Prioritize systems using HiSilicon hi3660 thermal hardware or kernels with this driver enabled.
Apply normal kernel reboot and rollback planning for availability-sensitive devices.
Validation and detection
Inventory kernel versions against the affected ranges in the CVE record.
Confirm whether the hisi hi3660 thermal driver is built or loaded.
Review vendor kernel changelogs for the referenced stable commit identifiers.
Monitor affected devices for kernel panic or fatal exception events.
Generated from the cited source records. This long-tail analysis has not been individually reviewed by a named human.
Potential ATT&CK relevance
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