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CVE Record

CVE-2023-33049: Improper Release of Memory Before Removing Last Reference in Multi-Mode Call Processor

Transient DOS in Multi-Mode Call Processor due to UE failure because of heap leakage.

HighCVSS 7.5Not KEV-listedUpdated
Glexia's TakeAutomated analysishigh

Security readout for executives and security teams

Plain-English summary

This Qualcomm Snapdragon issue can cause affected devices or connected modules to fail temporarily because memory is not released correctly. The business impact is availability: service interruption, device instability, or connectivity loss. The provided sources do not show data theft, integrity compromise, or confirmed active exploitation.

Executive priority

Treat this as a high-priority availability risk for affected embedded and mobile fleets, especially operational technology, automotive, IoT, and customer-facing connectivity products. It does not currently justify breach assumptions from the provided evidence, but it does warrant inventory-driven remediation tracking.

Technical view

CVE-2023-33049 is a CWE-401 heap leakage flaw in Qualcomm’s Multi-Mode Call Processor. CVSS 3.1 is 7.5, network attack vector, low complexity, no privileges, no user interaction, with high availability impact only. Qualcomm lists many Snapdragon, FastConnect, modem, automotive, IoT, audio, and Wi-Fi related products as affected.

Likely exposure

Exposure is most likely in phones, embedded systems, vehicles, IoT gateways, collaboration devices, and network-connected products using the listed Qualcomm chipsets or modules. Asset owners may need OEM, carrier, or device-vendor mapping because the affected component is usually embedded below the operating system.

Exploitation context

The source bundle marks KEV as false, and no cited source states active exploitation. The CVSS vector indicates a remotely reachable, unauthenticated denial-of-service condition, but the public bundle does not provide exploit details, observed attacks, or exploit maturity evidence.

Researcher notes

The public description is sparse: transient DoS from heap leakage causing UE failure in the Multi-Mode Call Processor. Qualcomm’s affected-product list is broad, but the bundle does not include vulnerable firmware versions, patch identifiers, proof-of-concept status, or attack preconditions beyond CVSS.

Mitigation direction

  • Inventory devices and products using the listed Qualcomm chipsets or modules.
  • Check Qualcomm’s February 2024 bulletin and the relevant OEM firmware advisories.
  • Apply vendor-provided firmware, baseband, modem, or component updates when available.
  • Prioritize systems where connectivity loss affects safety, operations, or customer service.
  • Monitor affected fleets for repeated UE failure, service drops, or unexplained restarts.

Validation and detection

  • Map hardware SKUs to Qualcomm chipset or module identifiers.
  • Compare device firmware levels against Qualcomm and OEM advisory guidance.
  • Confirm vulnerability scanners or SBOM records account for embedded Qualcomm components.
  • Review operational logs for availability events consistent with transient DoS.
  • Document devices without available OEM remediation and track vendor follow-up.
Prepared
Confidence
medium
Sources
3

Generated from the cited source records. This long-tail analysis has not been individually reviewed by a named human.

Potential ATT&CK relevance

Conservative CVE-to-ATT&CK context

These mappings and lookup hints may be relevant to the vulnerability behavior, CWE, affected product, or exposure path. Glexia-inferred context is not an official MITRE, ATT&CK, CWE, or CVE Program mapping.

ATT&CK lookup starting points

Use these exact CWE pages and searches to review the Glexia ATT&CK library from this CVE's weakness and description context.

cwe · low confidence lookup

CWE-401: Exact CWE lookup

Use the exact CWE identifier as the starting point before reviewing related ATT&CK behavior. Open the exact CWE lookup page first, then review the ATT&CK searches from that MITRE weakness context. This is a Glexia lookup hint, not an official ATT&CK mapping.

Open ATT&CK lookup
cve · low confidence lookup

CVE-2023-33049 mapping review

Open the CVE-to-ATT&CK bridge for reviewed, inferred, or future official mappings tied to this CVE.

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Vulnerability profileCVE Program record
Severity
High
CVSS
7.5 (3.1)
Known Exploited
No
Published

Vector: CVSS:3.1/AV:N/AC:L/PR:N/UI:N/S:U/C:N/I:N/A:H

Official CVE source material

CNA and ADP enrichment extracted from CVE v5

These fields come from the CVE record and ADP containers, not from Glexia's Take. They preserve time-varying source decisions such as CISA SSVC, KEV status, CVSS metrics, and provider references.

1CVSS vectors
0Timeline events
0ADP providers
2Source links

CVSS vector scores

1 official score

We collect every scored CVSS vector available in the official CNA and ADP containers. When more than one version is present, the table keeps the source vectors side by side instead of collapsing them into the highest score.

ScoreVersionSeverityVectorExploitImpactSource
7.5CVSS 3.1HighCVSS:3.1/AV:N/AC:L/PR:N/UI:N/S:U/C:N/I:N/A:H3.93.6Primary CVE score

Vulnerability scoring details

Base CVSS 3.1 score

7.5High
CVSS 3.1 vector shape for CVE-2023-33049Attack VectorAttack ComplexityPrivileges RequiredUser InteractionScopeConfidentiality ImpactIntegrity ImpactAvailability Impact

Vector: CVSS:3.1/AV:N/AC:L/PR:N/UI:N/S:U/C:N/I:N/A:H

Attack Vector
NetworkAdjacentLocalPhysical
Attack Complexity
LowHigh
Privileges Required
NoneLowHigh
User Interaction
NoneRequired
Scope
ChangedUnchanged
Confidentiality Impact
HighLowNone
Integrity Impact
HighLowNone
Availability Impact
HighLowNone
Affected products

Products and packages named in the record

VendorProductVersion / packageStatus
Qualcomm, Inc.Snapdragon315 5G IoT Modem, AR8035, FastConnect 6200, FastConnect 6700, FastConnect 6800, FastConnect 6900, FastConnect 7800, QCA6174A, QCA6391, QCA6421, QCA6426, QCA6431, QCA6436, QCA6574A, QCA6584AU, QCA6595AU, QCA6696, QCA6698AQ, QCA8081, QCA8337, QCC710, QCM4490, QCM6490, QCM8550, QCN6024, QCN6224, QCN6274, QCN9024, QCS4490, QCS6490, QCS8550, QEP8111, QFW7114, QFW7124, Qualcomm Video Collaboration VC3 Platform, SD855, SD865 5G, SD888, SDX55, SDX57M, SG8275P, SM7250P, SM7315, SM7325P, SM8550P, Snapdragon 4 Gen 1 Mobile Platform, Snapdragon 4 Gen 2 Mobile Platform, Snapdragon 480 5G Mobile Platform, Snapdragon 480+ 5G Mobile Platform (SM4350-AC), Snapdragon 690 5G Mobile Platform, Snapdragon 695 5G Mobile Platform, Snapdragon 750G 5G Mobile Platform, Snapdragon 765 5G Mobile Platform (SM7250-AA), Snapdragon 765G 5G Mobile Platform (SM7250-AB), Snapdragon 768G 5G Mobile Platform (SM7250-AC), Snapdragon 778G 5G Mobile Platform, Snapdragon 778G+ 5G Mobile Platform (SM7325-AE), Snapdragon 780G 5G Mobile Platform, Snapdragon 782G Mobile Platform (SM7325-AF), Snapdragon 7c+ Gen 3 Compute, Snapdragon 8 Gen 1 Mobile Platform, Snapdragon 8 Gen 2 Mobile Platform, Snapdragon 8 Gen 3 Mobile Platform, Snapdragon 8+ Gen 1 Mobile Platform, Snapdragon 8+ Gen 2 Mobile Platform, Snapdragon 855 Mobile Platform, Snapdragon 855+/860 Mobile Platform (SM8150-AC), Snapdragon 865 5G Mobile Platform, Snapdragon 865+ 5G Mobile Platform (SM8250-AB), Snapdragon 870 5G Mobile Platform (SM8250-AC), Snapdragon 888 5G Mobile Platform, Snapdragon 888+ 5G Mobile Platform (SM8350-AC), Snapdragon Auto 5G Modem-RF, Snapdragon Auto 5G Modem-RF Gen 2, Snapdragon X35 5G Modem-RF System, Snapdragon X55 5G Modem-RF System, Snapdragon X65 5G Modem-RF System, Snapdragon X70 Modem-RF System, Snapdragon X75 5G Modem-RF System, Snapdragon XR2 5G Platform, SXR2130, WCD9340, WCD9341, WCD9360, WCD9370, WCD9375, WCD9380, WCD9385, WCD9390, WCD9395, WCN3950, WCN3988, WCN6740, WSA8810, WSA8815, WSA8830, WSA8832, WSA8835, WSA8840, WSA8845, WSA8845Hunaffected
Weakness

CWE details

CWE links open Glexia weakness intelligence pages with official CWE context, developer remediation guidance, and related CVE mappings.

CWE-401 · source CWE mapping

Missing Release of Memory after Effective Lifetime

Missing Release of Memory after Effective Lifetime represents a recurring weakness pattern that can create exploitable paths when design, validation, or implementation controls are missing.