CVE-2022-49468: thermal/core: Fix memory leak in __thermal_cooling_device_register()
In the Linux kernel, the following vulnerability has been resolved:
thermal/core: Fix memory leak in __thermal_cooling_device_register()
I got memory leak as follows when doing fault injection test:
unreferenced object 0xffff888010080000 (size 264312):
comm "182", pid 102533, jiffies 4296434960 (age 10.100s)
hex dump (first 32 bytes):
00 00 00 00 ad 4e ad de ff ff ff ff 00 00 00 00 .....N..........
ff ff ff ff ff ff ff ff 40 7f 1f b9 ff ff ff ff ........@.......
backtrace:
[<0000000038b2f4fc>] kmalloc_order_trace+0x1d/0x110 mm/slab_common.c:969
[<00000000ebcb8da5>] __kmalloc+0x373/0x420 include/linux/slab.h:510
[<0000000084137f13>] thermal_cooling_device_setup_sysfs+0x15d/0x2d0 include/linux/slab.h:586
[<00000000352b8755>] __thermal_cooling_device_register+0x332/0xa60 drivers/thermal/thermal_core.c:927
[<00000000fb9f331b>] devm_thermal_of_cooling_device_register+0x6b/0xf0 drivers/thermal/thermal_core.c:1041
[<000000009b8012d2>] max6650_probe.cold+0x557/0x6aa drivers/hwmon/max6650.c:211
[<00000000da0b7e04>] i2c_device_probe+0x472/0xac0 drivers/i2c/i2c-core-base.c:561
If device_register() fails, thermal_cooling_device_destroy_sysfs() need be called
to free the memory allocated in thermal_cooling_device_setup_sysfs().
Security readout for executives and security teams
Plain-English summary
This Linux kernel issue can leak memory when registering a thermal cooling device fails. On affected systems, repeated triggering could reduce available memory and cause service disruption. The public sources describe availability impact, not data theft or privilege escalation.
Executive priority
Treat as a routine availability patch, not an emergency breach indicator. Prioritize shared Linux systems, appliance-like deployments, and environments where local users can repeatedly exercise kernel device paths.
Technical view
CVE-2022-49468 is a CWE-401 memory leak in thermal/core. If device_register() fails after thermal_cooling_device_setup_sysfs() allocated memory, cleanup did not call thermal_cooling_device_destroy_sysfs(). CVSS 3.1 is 5.5 with local, low-complexity, low-privilege availability impact.
Likely exposure
Exposure is limited to Linux kernels identified as affected by the CVE record and code paths registering thermal cooling devices. Risk is higher on systems where local users or drivers can repeatedly hit the failure path.
Exploitation context
The provided sources do not show active exploitation, public weaponization, or KEV listing. The CVSS vector requires local access and low privileges, with impact limited to availability through memory exhaustion.
Researcher notes
Evidence points to a missing cleanup call on the device_register() error path. The source bundle names stable kernel commits but does not provide exploit reports, distro-specific package states, or operational mitigations beyond applying fixed kernels.
Mitigation direction
Check distribution kernel advisories for CVE-2022-49468 coverage.
Update affected Linux kernels to builds containing the referenced stable fixes.
Prioritize systems with local multi-user access or relevant thermal device drivers.
Monitor affected hosts for abnormal kernel memory growth or availability degradation.
Validation and detection
Inventory running Linux kernel versions across exposed assets.
Compare kernel packages against vendor advisories and referenced stable commits.
Confirm thermal/core fix presence in downstream kernel changelogs.
Run regression testing for thermal device registration failure handling where applicable.
Generated from the cited source records. This long-tail analysis has not been individually reviewed by a named human.
Potential ATT&CK relevance
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Missing Release of Memory after Effective Lifetime
Missing Release of Memory after Effective Lifetime represents a recurring weakness pattern that can create exploitable paths when design, validation, or implementation controls are missing.