LiveActive security incident?Get immediate response
CVE Record

CVE-2019-14037: Close and bind operations done on a socket can lead to a Use-After-Free condition.

Close and bind operations done on a socket can lead to a Use-After-Free condition. in Snapdragon Auto, Snapdragon Compute, Snapdragon Connectivity, Snapdragon Consumer Electronics Connectivity, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon IoT, Snapdragon Mobile, Snapdragon Voice & Music, Snapdragon Wearables in APQ8009, APQ8053, APQ8096AU, APQ8098, MDM9206, MDM9207C, MDM9607, MDM9640, MDM9650, MSM8905, MSM8909W, MSM8996, MSM8996AU, QCN7605, QCN7606, QCS605, SC8180X, SDA660, SDA845, SDM439, SDM630, SDM636, SDM660, SDM670, SDM710, SDM845, SDX20, SDX24, SDX55, SM8150, SXR1130

UnknownCVSS not scoredNot KEV-listedUpdated
Glexia's TakeAutomated analysisunknown

Security readout for executives and security teams

Plain-English summary

CVE-2019-14037 is a Qualcomm Snapdragon socket-handling flaw where close and bind operations may cause use-after-free memory corruption. It affects many Snapdragon chipsets across mobile, IoT, automotive, compute, wearable, and connectivity product lines. The provided sources do not give a CVSS score, attack vector, or confirmed fixed versions.

Executive priority

Treat this as an inventory and firmware governance issue rather than a confirmed emergency. Prioritize high-value or hard-to-replace device fleets using affected Snapdragon chipsets, but avoid claims of active exploitation unless new evidence appears.

Technical view

The CVE describes a use-after-free condition during socket close and bind operations in multiple Qualcomm Snapdragon platforms. The affected list is chipset-based and spans APQ, MDM, MSM, QCN, QCS, SC, SDA, SDM, SDX, SM, and SXR families. The bundle does not include CWE, CVSS, privilege requirements, or exploitability details.

Likely exposure

Exposure is most likely in devices using the listed Qualcomm Snapdragon chipsets, especially embedded, IoT, mobile, automotive, wearable, and connectivity products whose OEM firmware has not incorporated Qualcomm’s July 2020 security guidance.

Exploitation context

The bundle does not show CISA KEV listing or any cited evidence of active exploitation. It also does not identify whether exploitation is local, remote, authenticated, or dependent on specific device configuration.

Researcher notes

Key gaps remain: no CVSS, CWE, affected software component, exploit preconditions, privilege boundary, or fixed-version matrix in the provided bundle. Research should focus on vendor bulletin detail, OEM patch mapping, and chipset-to-product exposure validation.

Mitigation direction

  • Identify products using the listed Qualcomm Snapdragon chipsets.
  • Review Qualcomm’s July 2020 bulletin and relevant OEM advisories.
  • Apply OEM firmware or security updates that reference CVE-2019-14037.
  • Prioritize managed, exposed, or safety-critical device fleets.
  • Track vendor guidance where fixed versions are not clearly documented.

Validation and detection

  • Confirm asset chipsets against the affected Qualcomm list.
  • Compare device firmware levels with OEM remediation advisories.
  • Check release notes for explicit CVE-2019-14037 coverage.
  • Document devices without available vendor fixes for risk acceptance.
  • Monitor Qualcomm and OEM security bulletins for updates.
Prepared
Confidence
medium
Sources
3

Generated from the cited source records. This long-tail analysis has not been individually reviewed by a named human.

Potential ATT&CK relevance

Conservative CVE-to-ATT&CK context

These mappings and lookup hints may be relevant to the vulnerability behavior, CWE, affected product, or exposure path. Glexia-inferred context is not an official MITRE, ATT&CK, CWE, or CVE Program mapping.

ATT&CK lookup starting points

Use these exact CWE pages and searches to review the Glexia ATT&CK library from this CVE's weakness and description context.

cve · low confidence lookup

CVE-2019-14037 mapping review

Open the CVE-to-ATT&CK bridge for reviewed, inferred, or future official mappings tied to this CVE.

Open ATT&CK lookup
Vulnerability profileCVE Program record
Severity
Unknown
CVSS
Not scored
Known Exploited
No
Published
Official CVE source material

CNA and ADP enrichment extracted from CVE v5

These fields come from the CVE record and ADP containers, not from Glexia's Take. They preserve time-varying source decisions such as CISA SSVC, KEV status, CVSS metrics, and provider references.

0CVSS vectors
0Timeline events
0ADP providers
2Source links

CVSS and timeline data

No CVSS vectors or timeline events were available in the normalized CVE source material.

Affected products

Products and packages named in the record

VendorProductVersion / packageStatus
Qualcomm, Inc.Snapdragon Auto, Snapdragon Compute, Snapdragon Connectivity, Snapdragon Consumer Electronics Connectivity, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon IoT, Snapdragon Mobile, Snapdragon Voice & Music, Snapdragon WearablesAPQ8009, APQ8053, APQ8096AU, APQ8098, MDM9206, MDM9207C, MDM9607, MDM9640, MDM9650, MSM8905, MSM8909W, MSM8996, MSM8996AU, QCN7605, QCN7606, QCS605, SC8180X, SDA660, SDA845, SDM439, SDM630, SDM636, SDM660, SDM670, SDM710, SDM845, SDX20, SDX24, SDX55, SM8150, SXR1130Listed
Weakness

CWE details

No CWE listed

CWE links open Glexia weakness intelligence pages with official CWE context, developer remediation guidance, and related CVE mappings.