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CVE Record

CVE-2018-13888: There is potential for memory corruption in the RIL daemon due to de reference of memory outside the alloca...

There is potential for memory corruption in the RIL daemon due to de reference of memory outside the allocated array length in RIL in Snapdragon Auto, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon Mobile, Snapdragon Wearables in versions MDM9206, MDM9607, MDM9635M, MDM9650, MSM8909W, SD 210/SD 212/SD 205, SD 425, SD 427, SD 430, SD 435, SD 439 / SD 429, SD 450, SD 625, SD 636, SD 650/52, SD 675, SD 712 / SD 710 / SD 670, SD 820A, SD 835, SD 845 / SD 850, SD 855, SDM439, SDM630, SDM660, ZZ_QCS605.

UnknownCVSS not scoredNot KEV-listedUpdated
Glexia's TakeAutomated analysis

Security readout for executives and security teams

CVE-2018-13888 is a Qualcomm Snapdragon RIL daemon memory-corruption issue. The RIL layer supports radio and cellular functions, so affected phones, IoT, wearables, and automotive devices may require OEM firmware or platform updates. The public bundle does not provide severity, CVSS, or confirmed exploitation. Exposure is most likely where an organization operates devices using the listed Qualcomm Snapdragon chipsets, especially Android, embedded IoT, wearable, or automotive systems that include Qualcomm radio interfaces. Confirming exposure requires mapping device models to chipsets and OEM firmware status. Set priority after exposure confirmation. The affected ecosystem is broad, but public evidence lacks severity scoring and exploitation confirmation. Organizations with Qualcomm-based fleets should drive OEM patch verification and unsupported-device decisions through normal vulnerability governance. Mitigation focus: Inventory devices using the listed Snapdragon chipsets and product families.; Check Qualcomm product security bulletins and OEM advisories for CVE-2018-13888.; Apply available OEM firmware, baseband, or Android security updates..

Prepared

Generated from the cited source records. This long-tail analysis has not been individually reviewed by a named human.

Potential ATT&CK relevance

Conservative CVE-to-ATT&CK context

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CVE-2018-13888 mapping review

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Vulnerability profileCVE Program record
Severity
Unknown
CVSS
Not scored
Known Exploited
No
Published
Official CVE source material

CNA and ADP enrichment extracted from CVE v5

These fields come from the CVE record and ADP containers, not from Glexia's Take. They preserve time-varying source decisions such as CISA SSVC, KEV status, CVSS metrics, and provider references.

0CVSS vectors
0Timeline events
0ADP providers
2Source links

CVSS and timeline data

No CVSS vectors or timeline events were available in the normalized CVE source material.

Source materials

Affected products

Products and packages named in the record

VendorProductVersion / packageStatus
Qualcomm, Inc.Snapdragon Auto, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon Mobile, Snapdragon WearablesMDM9206, MDM9607, MDM9635M, MDM9650, MSM8909W, SD 210/SD 212/SD 205, SD 425, SD 427, SD 430, SD 435, SD 439 / SD 429, SD 450, SD 625, SD 636, SD 650/52, SD 675, SD 712 / SD 710 / SD 670, SD 820A, SD 835, SD 845 / SD 850, SD 855, SDM439, SDM630, SDM660, ZZ_QCS605Listed
Weakness

CWE details

No CWE listed

CWE links open Glexia weakness intelligence pages with official CWE context, developer remediation guidance, and related CVE mappings.