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CVE Record

CVE-2018-11830: Improper input validation in QCPE create function may lead to integer overflow in Snapdragon Auto, Snapdrag...

Improper input validation in QCPE create function may lead to integer overflow in Snapdragon Auto, Snapdragon Consumer Electronics Connectivity, Snapdragon Industrial IOT, Snapdragon Mobile in MDM9206, MDM9607, MDM9650, MDM9655, MSM8996AU, SD 410/12, SD 820A

UnknownCVSS not scoredNot KEV-listedUpdated
Glexia's TakeAutomated analysisunknown

Security readout for executives and security teams

Plain-English summary

CVE-2018-11830 is a Qualcomm Snapdragon component vulnerability tied to weak input validation. The public record says it could cause an integer overflow in the QCPE create function. Business urgency depends on whether your products or managed devices contain the listed Qualcomm parts and whether OEM firmware updates exist.

Executive priority

Treat this as a supply-chain firmware risk with unknown severity. The immediate priority is exposure confirmation, not emergency response, unless a vendor advisory confirms affected deployed products or provides urgent remediation guidance.

Technical view

The CVE describes improper input validation in the QCPE create function, potentially leading to integer overflow. Affected entries include Snapdragon Auto, Consumer Electronics Connectivity, Industrial IoT, and Mobile products with MDM9206, MDM9607, MDM9650, MDM9655, MSM8996AU, SD 410/12, and SD 820A. No CVSS, CWE, reachability, or patch detail is provided in the bundle.

Likely exposure

Exposure is likely indirect through devices, modules, or products that embed the listed Qualcomm Snapdragon platforms. Organizations should focus on automotive, IoT, consumer electronics, mobile, and connectivity assets sourced from OEMs or integrators using those components.

Exploitation context

The bundle does not provide evidence of active exploitation, public exploit availability, exploit prerequisites, or inclusion in CISA KEV. It also does not describe whether attack requires local, adjacent, or remote access.

Researcher notes

The source bundle is sparse. It identifies the vulnerable function class and affected Qualcomm platforms but omits impact boundaries, attack surface, privileges, CVSS, CWE, and fix identifiers. Do not infer exploitability beyond the stated integer overflow risk.

Mitigation direction

  • Check Qualcomm Product Security Bulletins for advisory and remediation details.
  • Request firmware status from OEMs, device vendors, and integrators.
  • Prioritize updates for assets confirmed to use listed Qualcomm parts.
  • Track vendor firmware releases and maintenance windows.
  • Document unsupported affected assets for risk acceptance or replacement planning.

Validation and detection

  • Inventory devices for listed Qualcomm chipsets or platforms.
  • Map OEM model numbers to underlying Qualcomm components.
  • Compare deployed firmware versions against vendor advisories.
  • Confirm whether Qualcomm or OEM guidance lists this CVE as fixed.
  • Record evidence for affected, not affected, and unknown assets.
Prepared
Confidence
low
Sources
3

Generated from the cited source records. This long-tail analysis has not been individually reviewed by a named human.

Potential ATT&CK relevance

Conservative CVE-to-ATT&CK context

These mappings and lookup hints may be relevant to the vulnerability behavior, CWE, affected product, or exposure path. Glexia-inferred context is not an official MITRE, ATT&CK, CWE, or CVE Program mapping.

ATT&CK lookup starting points

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CVE-2018-11830 mapping review

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Vulnerability profileCVE Program record
Severity
Unknown
CVSS
Not scored
Known Exploited
No
Published
Official CVE source material

CNA and ADP enrichment extracted from CVE v5

These fields come from the CVE record and ADP containers, not from Glexia's Take. They preserve time-varying source decisions such as CISA SSVC, KEV status, CVSS metrics, and provider references.

0CVSS vectors
0Timeline events
0ADP providers
2Source links

CVSS and timeline data

No CVSS vectors or timeline events were available in the normalized CVE source material.

Source materials

Affected products

Products and packages named in the record

VendorProductVersion / packageStatus
Qualcomm, Inc.Snapdragon Auto, Snapdragon Consumer Electronics Connectivity, Snapdragon Industrial IOT, Snapdragon MobileMDM9206, MDM9607, MDM9650, MDM9655, MSM8996AU, SD 410/12, SD 820AListed
Weakness

CWE details

No CWE listed

CWE links open Glexia weakness intelligence pages with official CWE context, developer remediation guidance, and related CVE mappings.