CVE-2018-11258: In ADSP RPC in Snapdragon Automobile, Snapdragon Mobile and Snapdragon Wear, a Use After Free condition can...

Security readout for executives and security teams

This CVE concerns a memory safety flaw in Qualcomm ADSP RPC used by several Snapdragon mobile, wearable, and automotive chipsets. The public bundle does not provide severity, impact detail, or a named fix, so urgency depends on whether affected chipsets exist in managed devices and whether OEM firmware updates are available. Exposure is most likely in devices using the listed Qualcomm chipsets, including mobile devices, wearables, automotive platforms, and embedded systems. Practical exposure depends on OEM firmware lineage, support status, and whether the vulnerable ADSP RPC component is present and reachable. Handle as an exposure verification and vendor patch tracking item. It is not source-supported as an active exploitation emergency, but affected legacy or embedded devices may remain difficult to patch and should be identified. Mitigation focus: Check Qualcomm product security bulletins for vendor guidance.; Check OEM advisories for affected device models and firmware updates.; Update supported devices to vendor-approved firmware or security patches..

Prepared

Jun 7, 2026, 06:24 UTC (UTC+00:00)

Generated from the cited source records. This long-tail analysis has not been individually reviewed by a named human.