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CVE Record

CVE-2014-10056: In Android before 2018-04-05 or earlier security patch level on Qualcomm Snapdragon Mobile SD 210/SD 212/SD...

In Android before 2018-04-05 or earlier security patch level on Qualcomm Snapdragon Mobile SD 210/SD 212/SD 205, A buffer overflow can potentially occur in any OpenCL application that calls clBuildProgram() with a device of type CL_DEVICE_TYPE_CPU in its device_list argument.

UnknownCVSS not scoredNot KEV-listedUpdated
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Glexia's TakeAutomated analysis

Security readout for executives and security teams

This is an older Android/Qualcomm issue affecting devices with Snapdragon Mobile SD 210, SD 212, or SD 205 chipsets on Android security patch levels before 2018-04-05. A specially interacting OpenCL application could trigger a buffer overflow. Business urgency depends on whether these legacy devices remain in use. Exposure is most likely on older Android devices using Snapdragon SD 210, SD 212, or SD 205 that have not received the 2018-04-05 Android security patch level or later. Treat as an inventory and legacy-device risk issue, not an emergency based on current evidence. Escalate if affected chipsets remain in production or field devices with outdated Android patch levels. Mitigation focus: Inventory Android devices for Snapdragon SD 210, SD 212, and SD 205 chipsets.; Check Android security patch level; prioritize devices before 2018-04-05.; Apply vendor or carrier firmware updates that include the April 2018 Android security bulletin fixes..

Prepared

Generated from the cited source records. This long-tail analysis has not been individually reviewed by a named human.

Potential ATT&CK relevance

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Vulnerability profileCVE Program record
Severity
Unknown
CVSS
Not scored
Known Exploited
No
Published
Official CVE source material

CNA and ADP enrichment extracted from CVE v5

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0CVSS vectors
0Timeline events
0ADP providers
2Source links

CVSS and timeline data

No CVSS vectors or timeline events were available in the normalized CVE source material.

Source materials

Affected products

Products and packages named in the record

VendorProductVersion / packageStatus
Qualcomm, Inc.Snapdragon MobileSD 210/SD 212/SD 205Listed
Weakness

CWE details

No CWE listed

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